DocumentCode
1061251
Title
Transient temperature profiles within the active region of uniformly doped and high—Low doped Schottky IMPATT´s
Author
Amoss, John W. ; Elfe, Thomas B.
Author_Institution
Georgia Institute of Technology, Atlanta, GA
Volume
25
Issue
9
fYear
1978
fDate
9/1/1978 12:00:00 AM
Firstpage
1160
Lastpage
1166
Abstract
Results of an analytical investigation of transient and steady-state temperature and current profiles within the active region of a variety of IMPATT structures are presented. The analyses are based on thermal models which assume power dissipation distributions with an axial dependence proportional to the electric field intensity
and a radial dependence proportional to the local current density
. Examples are presented in which the local current density is assumed to decrease with the local temperature according to the expression
. The temperature gradients within the active region depend strongly on the doping profile. These analyses show that the maximum temperature at the edge of the active region can be as much as 25 percent higher than at the center of the avalanche region, especially for high-efficiency high-power structures where the ionization is highly localized and the electric-field intensity in the drift region is sufficiently high to prevent unsaturated drift velocities and depletion-layer modulation. Breakdown calculations using temperature-dependent ionization coefficients and axial temperature profiles suggest that actual temperatures within a device can be significantly higher than those measured experimentally by using a predetermined breakdown voltage versus temperature calibration curve. Curves are presented which show normalized current density and axial and radial temperature profiles within the active region of selected devices for various values of time.
and a radial dependence proportional to the local current density
. Examples are presented in which the local current density is assumed to decrease with the local temperature according to the expression
. The temperature gradients within the active region depend strongly on the doping profile. These analyses show that the maximum temperature at the edge of the active region can be as much as 25 percent higher than at the center of the avalanche region, especially for high-efficiency high-power structures where the ionization is highly localized and the electric-field intensity in the drift region is sufficiently high to prevent unsaturated drift velocities and depletion-layer modulation. Breakdown calculations using temperature-dependent ionization coefficients and axial temperature profiles suggest that actual temperatures within a device can be significantly higher than those measured experimentally by using a predetermined breakdown voltage versus temperature calibration curve. Curves are presented which show normalized current density and axial and radial temperature profiles within the active region of selected devices for various values of time.Keywords
Breakdown voltage; Current density; Doping profiles; Electron mobility; Intensity modulation; Ionization; Power dissipation; Steady-state; Temperature dependence; Transient analysis;
fLanguage
English
Journal_Title
Electron Devices, IEEE Transactions on
Publisher
ieee
ISSN
0018-9383
Type
jour
DOI
10.1109/T-ED.1978.19242
Filename
1479636
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