A hybrid mass-interconnection method by electroplating

A novel mass-interconnection method is described. The method utilizes electroplating of thin-film metallizations to interconnect simultaneously large numbers of small contacts via electroplated bridges. The bridges can be formed between similar or dissimilar materials; for instance, infrared detectors and charge-coupled devices in a hybrid circuit. The unique method eliminates difficulties in joining small and closely spaced contacts, particularly in the fabrication of focal plane structures for infrared imaging systems. Detailed fabrication steps, mechanism, advantages, and potential applications of the method are reported.