DocumentCode :
1061788
Title :
Wafer Scale Interconnections for GaAs Packaging-Applications to RISC Architecture
Author :
Mcdonald, Jack E. ; Greub, Hans J. ; Steinvorth, Randy H. ; Donlan, Brian J. ; Bergendahl, Albert S.
Author_Institution :
Rensselaer Polytechnic Institute
Volume :
20
Issue :
4
fYear :
1987
fDate :
4/1/1987 12:00:00 AM
Firstpage :
21
Lastpage :
35
Keywords :
Costs; Gallium arsenide; Instruments; Integrated circuit interconnections; MESFETs; MMICs; Packaging; Reduced instruction set computing; Silicon; Wiring;
fLanguage :
English
Journal_Title :
Computer
Publisher :
ieee
ISSN :
0018-9162
Type :
jour
DOI :
10.1109/MC.1987.1663533
Filename :
1663533
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=1061788
