• DocumentCode
    1061884
  • Title

    A Microvalve With Integrated Sensors and Customizable Normal State for Low-Temperature Operation

  • Author

    Park, Jong M. ; Evans, Allan T. ; Rasmussen, Kristian ; Brosten, Tyler R. ; Nellis, Gregory F. ; Klein, Sanford A. ; Gianchandani, Yogesh B.

  • Author_Institution
    Dept. of Electr. Eng. & Comput. Sci., Univ. of Michigan, Ann Arbor, MI, USA
  • Volume
    18
  • Issue
    4
  • fYear
    2009
  • Firstpage
    868
  • Lastpage
    877
  • Abstract
    This paper reports on design, fabrication, and testing of a piezoelectrically actuated microvalve with integrated sensors for flow modulation at low temperatures. One envisioned application is to control the flow of a cryogen for distributed cooling with a high degree of temperature stability and a small thermal gradient. The valve consists of a micromachined die fabricated from a silicon-on-insulator wafer, a glass wafer, a commercially available piezoelectric stack actuator, and Macor ceramic encapsulation that has overall dimensions of 1.5 x 1.5 x 1.1 cm3. A piezoresistive pressure sensor and a thin-film Pt resistance temperature detector are integrated on the silicon die. The assembly process allows the implementation of normally open, partially open, and normally closed valves. At room temperature, gas flow modulation from 200 to 0 mL/min is achieved from 0- to 40-V actuation. Flow modulation at various temperatures from room temperature to 205 K is also reported. The pressure sensor has sensitivity of 356 ppm/kPa at room temperature, with temperature coefficient of sensitivity of -6507 ppm/K. The temperature sensor has sensitivity of 0.29 %/K. The valve and the sensors are tested across a wide range of temperatures, and the effect of temperature on performance is discussed.
  • Keywords
    cryogenics; microvalves; piezoelectric actuators; pressure sensors; silicon-on-insulator; temperature sensors; thermal stability; Macor ceramic encapsulation; cryogen; distributed cooling; gas flow modulation; glass wafer; integrated sensors; low-temperature operation; micromachined die; piezoelectric stack actuator; piezoelectrically actuated microvalve; piezoresistive pressure sensor; silicon-on-insulator wafer; temperature 293 K to 298 K; temperature sensor; temperature stability; thermal gradient; thin-film Pt resistance temperature detector; voltage 0 V to 40 V; Cooling systems; cryogenic; microelectromechanical systems (MEMS); piezoelectric; piezoresistive pressure sensor; resistance temperature detector (RTD);
  • fLanguage
    English
  • Journal_Title
    Microelectromechanical Systems, Journal of
  • Publisher
    ieee
  • ISSN
    1057-7157
  • Type

    jour

  • DOI
    10.1109/JMEMS.2009.2021097
  • Filename
    5067289