DocumentCode
1062460
Title
Micromachining of Air-Bridges on SU-8 Substrates
Author
Miller, Jabberia R. ; Harriss, James E. ; Pearson, L.Wilson
Author_Institution
Northrop Grumman Corp., Baltimore
Volume
31
Issue
1
fYear
2008
fDate
3/1/2008 12:00:00 AM
Firstpage
159
Lastpage
164
Abstract
This paper describes a procedure developed to fabricate air-bridges on coplanar transmission lines using a SU-8 substrate. SU-8 is attractive for micromachined multilayer circuit fabrication because it is photo-polymerizable resin, leading to safe, economical processing. The ability to fabricate air-bridges provides a means of suppressing the coupled slotline mode, thereby enabling single-mode design. The air-bridges also provide ground equalization at coplanar discontinuities. The properties of the air-bridge are investigated and compared to similar structures without air-bridges. As examples of possible device applications of this technology, an asymmetrical slot antenna and coplanar waveguide both operating at 35 GHz are presented. The return loss of both devices is 5 dB lower on structures that contain the air-bridge. This technology is promising for extending the use of SU-8 at millimeter-wave frequencies.
Keywords
coplanar transmission lines; electronics packaging; micromachining; plastic packaging; resins; slot antennas; slot lines; SU-8 substrates; air-bridges; asymmetrical slot antenna; coplanar discontinuities; coplanar transmission lines; coplanar waveguide; coupled slotline mode; frequency 35 GHz; ground equalization; micromachining; multilayer circuit fabrication; photo-polymerizable resin; single-mode design; Air-Bridge fabrication; micromachining;
fLanguage
English
Journal_Title
Components and Packaging Technologies, IEEE Transactions on
Publisher
ieee
ISSN
1521-3331
Type
jour
DOI
10.1109/TCAPT.2008.916846
Filename
4447847
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