• DocumentCode
    1062460
  • Title

    Micromachining of Air-Bridges on SU-8 Substrates

  • Author

    Miller, Jabberia R. ; Harriss, James E. ; Pearson, L.Wilson

  • Author_Institution
    Northrop Grumman Corp., Baltimore
  • Volume
    31
  • Issue
    1
  • fYear
    2008
  • fDate
    3/1/2008 12:00:00 AM
  • Firstpage
    159
  • Lastpage
    164
  • Abstract
    This paper describes a procedure developed to fabricate air-bridges on coplanar transmission lines using a SU-8 substrate. SU-8 is attractive for micromachined multilayer circuit fabrication because it is photo-polymerizable resin, leading to safe, economical processing. The ability to fabricate air-bridges provides a means of suppressing the coupled slotline mode, thereby enabling single-mode design. The air-bridges also provide ground equalization at coplanar discontinuities. The properties of the air-bridge are investigated and compared to similar structures without air-bridges. As examples of possible device applications of this technology, an asymmetrical slot antenna and coplanar waveguide both operating at 35 GHz are presented. The return loss of both devices is 5 dB lower on structures that contain the air-bridge. This technology is promising for extending the use of SU-8 at millimeter-wave frequencies.
  • Keywords
    coplanar transmission lines; electronics packaging; micromachining; plastic packaging; resins; slot antennas; slot lines; SU-8 substrates; air-bridges; asymmetrical slot antenna; coplanar discontinuities; coplanar transmission lines; coplanar waveguide; coupled slotline mode; frequency 35 GHz; ground equalization; micromachining; multilayer circuit fabrication; photo-polymerizable resin; single-mode design; Air-Bridge fabrication; micromachining;
  • fLanguage
    English
  • Journal_Title
    Components and Packaging Technologies, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1521-3331
  • Type

    jour

  • DOI
    10.1109/TCAPT.2008.916846
  • Filename
    4447847