DocumentCode :
1062666
Title :
New acceleration factors for temperature, humidity, bias testing
Author :
Sbar, N.L. ; Kozakiewicz, R.P.
Author_Institution :
Bell Laboratories, Allentown, PA
Volume :
26
Issue :
1
fYear :
1979
fDate :
1/1/1979 12:00:00 AM
Firstpage :
56
Lastpage :
71
Abstract :
New temperature-humidity acceleration factors for surface conductance ( 
) were determined. These can be used to relate device life in a high-stress laboratory environment to device life in a normal-use environment. Analytical expressions for the acceleration factors were derived for both encapsulated and unencapsulated test specimens. Lower acceleration factors were predicted for specimens encapsulated with DC 3-6550 RTV silicone rubber than for unencapsulated specimens. The new acceleration factors were used to predict failure rates due to electrolytic conduction on active devices.
) were determined. These can be used to relate device life in a high-stress laboratory environment to device life in a normal-use environment. Analytical expressions for the acceleration factors were derived for both encapsulated and unencapsulated test specimens. Lower acceleration factors were predicted for specimens encapsulated with DC 3-6550 RTV silicone rubber than for unencapsulated specimens. The new acceleration factors were used to predict failure rates due to electrolytic conduction on active devices.Keywords :
Acceleration; Circuit testing; Conductors; Humidity; Life estimation; Metallization; Silicon; Stress; Temperature; Vehicles;
fLanguage :
English
Journal_Title :
Electron Devices, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9383
Type :
jour
DOI :
10.1109/T-ED.1979.19380
Filename :
1479958
Link To Document :
