Title :
High-Power Light-Emitting Diodes Package With Phase Change Material
Author :
Yu Zhao ; Jun Liu ; Aixiang Wei ; Jian Li
Author_Institution :
Sch. of Mater. & Energy, Guangdong Univ. of Technol., Guangzhou, China
Abstract :
We report the fabrication and charaterization of high-power light-emitting diodes (LEDs) package with phase change material. Paraffin wax with melting point of 49.6 °C was inserted between the LED die and silicone encapsulant. The phase changing of embedded wax in a working LED is observed by studying its output flux and junction temperature. With a driving current density of 443 mA/mm$^{mathrm {mathbf {2}}}$ , LED sample demonstrates a decreasing of junction temperature by 19 °C and an increasing of light flux by 25% with the insertion of 6-mg paraffin wax. Optical and thermal simulations are employed to analyze the improved performance of LED package. Higher thermal conductivity of paraffin wax compared with silicone resin is considered to be reason for LED´s reduced junction temperature. The high refractive index of paraffin wax is considered to be the dominant mechanism of LEDs enhanced emission.
Keywords :
light emitting diodes; phase change materials; semiconductor device manufacture; semiconductor device packaging; silicones; thermal conductivity; LED; high-power light-emitting diodes package; optical simulations; paraffin wax; phase change material; refractive index; silicone encapsulant; temperature 19 C; temperature 49.6 C; thermal conductivity; thermal simulations; Junctions; Light emitting diodes; Phase change materials; Solids; Temperature; Temperature measurement; Junction temperature; light-emitting diodes (LEDs); paraffin wax; phase change material (PCM); phase change material (PCM).;
Journal_Title :
Components, Packaging and Manufacturing Technology, IEEE Transactions on
DOI :
10.1109/TCPMT.2014.2359621