• DocumentCode
    1063290
  • Title

    A fully implanted NMOS, CMOS, bipolar technology for VLSI of analog-digital systems

  • Author

    Zimmer, Günter ; Hoefflinger, Bernd ; Schneider, Joachim

  • Author_Institution
    University of Dortmund, Dortmund, Germany
  • Volume
    26
  • Issue
    4
  • fYear
    1979
  • fDate
    4/1/1979 12:00:00 AM
  • Firstpage
    390
  • Lastpage
    396
  • Abstract
    A fully ion-implanted process allows high-density integration of NMOS, CMOS, and bipolar transistors for VLSI of analog-digital systems. Supply voltage can be 20 V. Thresholds are ± 1.5 V for p- and n-channel enhancement transistors, respectively. Standard deviation per wafer is 15 mV for the NMOS threshold, while the NMOS gain constant is 30 µAV-2. The bipolar transistors have a low-resistance base contact. Current gain βFcan be set independently. For \\beta _{F} = 90 , the Early voltage is V_{A} = 110 V. No epi layer, isolation diffusions, or channel stoppers are required. The mask count is 6 for structure definition plus 2 for the masking of implants. The process can be scaled along the learning curve of digital MOS VLSI.
  • Keywords
    Analog-digital conversion; Bipolar transistors; CMOS process; CMOS technology; Circuits; Implants; Large scale integration; MOS devices; Very large scale integration; Voltage;
  • fLanguage
    English
  • Journal_Title
    Electron Devices, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9383
  • Type

    jour

  • DOI
    10.1109/T-ED.1979.19440
  • Filename
    1480018