DocumentCode
1063290
Title
A fully implanted NMOS, CMOS, bipolar technology for VLSI of analog-digital systems
Author
Zimmer, Günter ; Hoefflinger, Bernd ; Schneider, Joachim
Author_Institution
University of Dortmund, Dortmund, Germany
Volume
26
Issue
4
fYear
1979
fDate
4/1/1979 12:00:00 AM
Firstpage
390
Lastpage
396
Abstract
A fully ion-implanted process allows high-density integration of NMOS, CMOS, and bipolar transistors for VLSI of analog-digital systems. Supply voltage can be 20 V. Thresholds are ± 1.5 V for p- and n-channel enhancement transistors, respectively. Standard deviation per wafer is 15 mV for the NMOS threshold, while the NMOS gain constant is 30 µAV-2. The bipolar transistors have a low-resistance base contact. Current gain βF can be set independently. For
, the Early voltage is
V. No epi layer, isolation diffusions, or channel stoppers are required. The mask count is 6 for structure definition plus 2 for the masking of implants. The process can be scaled along the learning curve of digital MOS VLSI.
, the Early voltage is
V. No epi layer, isolation diffusions, or channel stoppers are required. The mask count is 6 for structure definition plus 2 for the masking of implants. The process can be scaled along the learning curve of digital MOS VLSI.Keywords
Analog-digital conversion; Bipolar transistors; CMOS process; CMOS technology; Circuits; Implants; Large scale integration; MOS devices; Very large scale integration; Voltage;
fLanguage
English
Journal_Title
Electron Devices, IEEE Transactions on
Publisher
ieee
ISSN
0018-9383
Type
jour
DOI
10.1109/T-ED.1979.19440
Filename
1480018
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