Title :
Single photon counting X-ray imaging with Si and CdTe single chip pixel detectors and multichip pixel modules
Author :
Löcker, Mario ; Fischer, Peter ; Krimmel, Sven ; Krüger, Hans ; Lindner, Markus ; Nakazawa, Kazuhiro ; Takahashi, Tadayuki ; Wermes, Norbert
Author_Institution :
Bonn Univ., Germany
Abstract :
Multichip modules (MCM) have been successfully built and operated. These use 4 single-photon counting MPEC 2.3 chips that are bump bonded to 1.3 cm × 1.3 cm CdTe or Si semiconductor pixel sensors. Single-chip detectors were built as well. The MPEC 2.3 chip provides a pixel count rate up to 1 MHz with a large dynamic range of 18 bits, 2 counters and energy windowing with continuously adjustable thresholds. Each MPEC has 32 × 32 pixels of 200 μm × 200 μm pixel size. For a MCM the 4 chips are arranged in a 2 × 2 array which leads to a 64 × 64 sensor pixel geometry. The MCM construction is described, and the imaging performance of the different detectors is shown. A newly developed USB readout system has been used.
Keywords :
X-ray imaging; multichip modules; photon counting; position sensitive particle detectors; readout electronics; semiconductor counters; silicon radiation detectors; 1 MHz; 1.3 cm; 1024 pixel; 200 micron; 32 pixel; 4096 pixel; 64 pixel; CdTe single chip pixel detectors; MCM; MPEC 2.3 chips; Si single chip pixel detectors; USB readout system; bits; bump bonding; continuously adjustable thresholds; counters; energy windowing; imaging performance; multichip pixel modules; pixel count rate; pixel size; sensor pixel geometry; single photon counting X-ray imaging; Bonding; Counting circuits; Dynamic range; Multichip modules; Optoelectronic and photonic sensors; Pixel; Sensor arrays; X-ray detection; X-ray detectors; X-ray imaging;
Journal_Title :
Nuclear Science, IEEE Transactions on
DOI :
10.1109/TNS.2004.832610
