• DocumentCode
    1064244
  • Title

    CdTe nuclear detector electroless contact Studies-new results on contact structures, interfaces, and stress

  • Author

    Ali, M. Hage ; Ayoub, M. ; Roumie, M. ; Lmai, F. ; Zahraman, K. ; Nsouli, B. ; Sowinksa, M.

  • Author_Institution
    PHASE Lab., Strasbourg, France
  • Volume
    51
  • Issue
    4
  • fYear
    2004
  • Firstpage
    1875
  • Lastpage
    1880
  • Abstract
    Although electroless contacts are the most used contacts on II-VI semiconductor materials (CdTe family) to solve many problems, they are difficult to understand and to control. For this paper, we have chosen two II-VI materials, CdTe and ZnTe, and three metals: Au, Pt, and Pd. For the characterization methods, we have chosen Rutherford backscattering (RBS), secondary ions mass spectroscopy (SIMS), and partially Auger for the contacts and interface structures, stoichiometry, and composition profiles. Electrical measurements, PICTS and TEES, are done to find out defect level concentrations and nature, as well as the possible correlation with the composition concentrations. As first parameter change, we have chosen the solution dilution in the electroless deposition process, while the other parameters were frozen. This allows us to drive and to see a drastic variation in the profile of the metal, the two constituent materials and the oxygen in the metal layer. The same has been seen at the interface where the VCd concentration profile shows sensible variation too. We have found a clear connection with specific electrical defect concentrations. The validity of these concentration measurements in the bulk are then subject to questions. The comparison with evaporated contacts is done for bulk and surface property separations. Contact induced stress is simulated by static pressure in longitudinal and transversal direction. We have driven out the induced defect natures and concentrations. The limit of operation under stress is also given.
  • Keywords
    Auger electron spectroscopy; II-VI semiconductors; Rutherford backscattering; defect states; electroless deposition; gold; interface structure; palladium; platinum; secondary ion mass spectroscopy; semiconductor counters; stoichiometry; stress analysis; surface structure; thermoelectricity; thin films; Au; Auger spectroscopy; CdTe nuclear detector electroless contact studies; II-VI semiconductor materials; PICTS; Pd; Pt; RBS; Rutherford backscattering; SIMS; ZnTe; bulk material; composition concentration; composition profile; contact induced stress; contact structure; electrical defect level concentration; electroless deposition thin film; evaporated contacts; induced defect nature; interface structure; longitudinal direction; operation under stress; secondary ions mass spectroscopy; solution dilution; static pressure; stoichiometry; surface property separation; thermoelectric effect spectroscopy; transversal direction; Backscatter; Composite materials; Contacts; Detectors; Gold; II-VI semiconductor materials; Inorganic materials; Mass spectroscopy; Stress; Zinc compounds;
  • fLanguage
    English
  • Journal_Title
    Nuclear Science, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9499
  • Type

    jour

  • DOI
    10.1109/TNS.2004.832678
  • Filename
    1323785