Title :
The Fracture Resistance of Bonded Au Wires for Interconnection
Author :
Jin-Woo Park ; Young-Bok Yoon ; Lee, Joon-Gil
Author_Institution :
Dept. of Mater. Sci. & Eng., Yonsei Univ., Seoul
fDate :
3/1/2009 12:00:00 AM
Abstract :
This paper presents the effects of the local strength degradation due to recrystallization and grain growth and the large deformation induced in wire bonding process on the fracture resistance of the bonded Au wires for interconnection. The experimental and numerical results show that, for a wire to deform to the required shape without reduction in the fracture resistance, sufficient ductility is more important than the strength of the wire.
Keywords :
deformation; ductility; electronics packaging; finite element analysis; fracture; gold; interconnections; recrystallisation; Au; bonded Au wires; ductility; finite-element model; fracture resistance; interconnection; large deformation; local strength degradation; recrystallization; wire bonding process; Finite-element model (FEM); nano-indentation; recrystallization; wire bonding;
Journal_Title :
Components and Packaging Technologies, IEEE Transactions on
DOI :
10.1109/TCAPT.2008.2004584
