Title :
Temperature Characteristics of Superconducting Thin-Film Fault Current Limiting Elements Using High-Resistivity Alloy Shunt Layers
Author :
Arai, Kazuaki ; Yamasaki, Hirofumi ; Kaiho, Katsuyuki ; Furuse, Mitsuho ; Nakagawa, Yoshihiko
Author_Institution :
Nat. Inst. of Adv. Ind. Sci. & Technol., Ibaraki
fDate :
6/1/2007 12:00:00 AM
Abstract :
We have been investigating a superconducting fault current limiter (FCL), in which YBCO superconducting thin films with Au-Ag alloy shunt layers are used. The ability of the films to withstand high electric fields (> 40 Vpeak/cm) enables the total length of FCL elements to be reduced, thus greatly reducing the cost of FCLs. In this paper, we report the temperature characteristics of Au-Ag/YBCO composite films with sapphire substrates. Temperature of the film was estimated as average temperature from voltage and current in the films during the over-current period of 0.1 s using the relation between their resistance and temperature. The effect of thickness of the substrate was examined. Temperature data were analysed with the relation between the maximum temperature and joule heating during the over-current period. Data on recovery time are also shown.
Keywords :
barium compounds; composite superconductors; electrical resistivity; fault current limiters; gold alloys; high-temperature superconductors; silver alloys; superconducting thin films; thin film devices; yttrium compounds; AuAg-YBa2Cu3O7; composite films; fault current limiting elements; high-resistivity alloy shunt layers; joule heating; recovery time; sapphire substrates; superconducting thin film; temperature characteristics; Costs; Fault current limiters; Fault currents; Substrates; Superconducting epitaxial layers; Superconducting films; Superconducting materials; Superconducting thin films; Temperature; Yttrium barium copper oxide; Au-Ag alloy shunt layers; YBCO thin film; superconducting fault current limiter; temperature characteristics;
Journal_Title :
Applied Superconductivity, IEEE Transactions on
DOI :
10.1109/TASC.2007.898200