Title :
A 35-to-83 GHz Multiconductor-Lines Signal Combiner for High Linear and Wideband Mixer
Author :
Hwann-Kaeo Chiou ; Hung-Ting Chou ; Chia-Jen Liang
Author_Institution :
Dept. of Electr. Eng., Nat. Central Univ., Jhongli, Taiwan
Abstract :
This letter proposes a broadband and low-loss multiconductor-lines signal combiner in 90 nm CMOS. The signal combiner consists of one broadside-coupled balun, two broadband in-phase power dividers, one edge-coupled balun, and four impedance-transformation lines. By using thin-film microstrip lines to avoid the loss from silicon substrate, the signal combiner has a simulated insertion loss of 8.1 dB and port-to-port isolations better than 42 dB from 35 to 83 GHz. The signal combiner is then integrated into a source-pumped mixer, and a -1±1.5-dB conversion gain and a 13 dBm average input IP3 at a 6.5 mW total dc power are achieved in measurements.
Keywords :
CMOS integrated circuits; baluns; coupled circuits; microstrip lines; millimetre wave integrated circuits; mixers (circuits); multiconductor transmission lines; power combiners; power dividers; thin film circuits; CMOS technology; Si; broadband in-phase power divider; broadside-coupled balun; edge-coupled balun; frequency 35 GHz to 83 GHz; high linear wideband mixer; impedance-transformation line; insertion loss; loss 8.1 dB; low-loss broadband multiconductor-line signal combiner; port-to-port isolation; power 6.5 mW; size 90 nm; source-pumped mixer; thin-film microstrip line; Broadband communication; Gain; Impedance matching; Linearity; Loss measurement; Mixers; Radio frequency; Balun; broadside-coupled; linearity; mixer; multiconductor-lines; signal combiner; thin-film microstrip line;
Journal_Title :
Microwave and Wireless Components Letters, IEEE
DOI :
10.1109/LMWC.2013.2279099