Title :
Implementation and Experimental Evaluation of a Cryocooled System Prototype for High-Throughput SFQ Digital Applications
Author :
Hashimoto, Yoshihito ; Yorozu, Shinichi ; Miyazaki, Toshiyuki ; Kameda, Yoshio ; Suzuki, Hideo ; Yoshikawa, Nobuyuki
Author_Institution :
Int. Supercond. Technol. Center (ISTEC), Tsukuba
fDate :
6/1/2007 12:00:00 AM
Abstract :
We report on development of a cryocooled system prototype for high-throughput single flux quantum (SFQ) digital applications. The system was designed to have 32 I/O links with a bandwidth of 10 Gbps/port. An SFQ multi-chip module (MCM), double mu-metal magnetic shields, a 40-K radiation shield, customized GaAs cryogenic amplifiers, a 32-pin wide-bandwidth cryo-probe, and 32 I/O cables were packaged in a vacuum chamber together with a two-stage 4-K 1-W Gifford-McMahon (G-M) cryocooler. S-parameter measurements showed that the analog bandwidth of the I/O link was 23 GHz. We demonstrated high-speed cryocooled operation of a test module, in which a 5 mm times 5 mm SFQ circuit chip was flip-chip bonded on a 16 mm times 16 mm MCM carrier with phi30 mum InSn bump bonds, at bit rates up to 12.5 Gbps. Measured bit error rate (BER) was less than 10-12 for a 1023 - 1 pseudorandom bit sequence (PRBS) at 10 Gbps.
Keywords :
amplifiers; cryogenic electronics; error statistics; flip-chip devices; gallium arsenide; integrated circuit design; magnetic flux; multichip modules; GaAs - Binary; Gifford-McMahon cryocooler; MCM carrier; S-parameter measurement; SFQ circuit chip; bandwidth 23 GHz; bit rate 12.5 Gbit/s; cryocooled system prototype; cryogenic amplifiers; cryopackaging; double mu-metal magnetic shields; flip-chip; high-throughput SFQ digital application; integrated circuit; multichip module; pseudorandom bit sequence; single flux quantum; size 16 mm; size 25 mm; size 256 mm; size 5 mm; superconductor; vacuum chamber; Bandwidth; Bit error rate; Broadband amplifiers; Circuit testing; Cryogenics; Gallium arsenide; Magnetic flux; Magnetic shielding; Prototypes; Semiconductor device measurement; Cryocooler; SFQ; cryopackaging; integrated circuit; multi-chip module; superconductor;
Journal_Title :
Applied Superconductivity, IEEE Transactions on
DOI :
10.1109/TASC.2007.898126