High-performance large-inductance embedded inductors in thin array plastic packaging (TAPP) for RF system-in-package applications

Author

Chen, Kevin J. ; Chan, Kwok Wai ; Wong, Michael K W ; Fok, Norman M K ; Kwan, Kenneth K P ; Fan, Nelson C H

Author_Institution

Dept. of Electr. & Electron. Eng., Hong Kong Univ. of Sci. & Technol., China

Volume

14

Issue

9

fYear

2004

Firstpage

449

Lastpage

451

Abstract

We report the first demonstration of high-Q embedded inductors fabricated using a thin-array-plastic-packaging (TAPP) technology. The TAPP technology provides a platform that integrates digital, analog, RF integrated circuits, along with high-performance passive components for system-in-package implementation. Embedded inductors ranging from 14 to 300 nH were fabricated. All the inductors with inductance less than 100 nH exhibit self-resonant frequency above 1 GHz. For a 14-nH inductor, Q factor of 35 was achieved at 1.6 GHz and the self-resonance frequency was measured at 6.15 GHz.

Keywords

MMIC; inductors; plastic packaging; 1.6 GHz; 6.15 GHz; RF integrated circuits; RF system-in-package applications; TAPP technology; analog integrated circuits; digital integrated circuits; high-performance embedded inductors; large-inductance embedded inductors; self-resonant frequency; thin array plastic packaging; Analog integrated circuits; Digital integrated circuits; Inductance; Inductors; Integrated circuit technology; Plastic packaging; Q factor; Q measurement; Radio frequency; Radiofrequency integrated circuits; Embedded inductors; SIP; high-Q; mold compound; system-in-package; thin array plastic packaging;

fLanguage

English

Journal_Title

Microwave and Wireless Components Letters, IEEE

Publisher

ieee

ISSN

1531-1309

Type

jour

DOI

10.1109/LMWC.2004.832082

Filename

1324744