DocumentCode :
1067375
Title :
Abstracts of forthcoming manuscripts
Volume :
25
Issue :
3
fYear :
2002
fDate :
7/1/2002 12:00:00 AM
Firstpage :
151
Lastpage :
153
Abstract :
Provides an abstract of articles to be presented in a forthcoming issue.
fLanguage :
English
Journal_Title :
Electronics Packaging Manufacturing, IEEE Transactions on
Publisher :
ieee
ISSN :
1521-334X
Type :
jour
DOI :
10.1109/TEPM.2002.807532
Filename :
1158823
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=1067375
