Reliability investigations of hard core solder bumps using mechanical palladium bumps and SnPb solder

Author

Oppermann, Hermann ; Kalicki, Robert ; Anhoeck, Sabine ; Kallmayer, Christine ; Klein, Matthias ; Aschenbrenner, Rolf ; Reichl, Herbert

Author_Institution

Univ. of Tokyo, Japan

Volume

25

Issue

3

fYear

2002

fDate

7/1/2002 12:00:00 AM

Firstpage

210

Lastpage

216

Abstract

The choice of solder joint metallurgy is a key issue especially for the reliability of flip-chip assemblies. Besides the metallurgical systems already widely used and well understood, new materials are emerging as solderable under bump metallization (UBM). For single chip bumping Pd stud bumps form a solid core under the solder layer. These hard core solder bumps are an adequate solution if single dies are available only and the chosen assembly technology is flip chip soldering. The scope of this paper is to summarize the results from aging of lead/tin solder bumps on palladium. The growth of intermetallic and its impact on the mechanical reliability are investigated.

Keywords

ageing; chip-on-board packaging; circuit reliability; flip-chip devices; lead alloys; metallisation; palladium; soldering; tin alloys; SnPb solder; SnPb-Pd; flip chip soldering; flip-chip assemblies; hard core solder bumps; intermetallics; mechanical palladium bumps; mechanical reliability; solder bump aging; solder joint metallurgy; under bump metallization; Aging; Assembly; Flip chip; Inorganic materials; Lead; Metallization; Palladium; Soldering; Solids; Tin;

fLanguage

English

Journal_Title

Electronics Packaging Manufacturing, IEEE Transactions on

Publisher

ieee

ISSN

1521-334X

Type

jour

DOI

10.1109/TEPM.2002.806787

Filename

1158831