Title :
Characteristics of a 3-D HTS Actuator With Various Shaped Electromagnets
Author :
Kim, S.B. ; Inoue, T. ; Shimizu, A. ; Joo, J.H. ; Murase, S.
Author_Institution :
Okayama Univ., Okayama
fDate :
6/1/2007 12:00:00 AM
Abstract :
We have been investigating a three-dimensional (3-D) superconducting actuator using HTS bulk to develop the transportation device with non-contact and move in free space. Proposed superconducting actuator consists of the stator constructed by two-dimensional arranged electromagnets and HTS bulk superconductor as a mover. The 2-D arranged electromagnets were individually controlled to move the HTS bulk. It is expected that our proposed 3-D superconducting actuator will be useful as a transporter used in clean rooms where silicon wafers are manufactured. Wafers must be protected from contact with dust and other contamination. To realize the superconducting actuator with HTS bulks, the electromagnetic characteristics of HTS bulk, such as trapped field strength and patterns, should be clarified and the optimized controlling system is also required. Therefore, in this study, to construct the optimal 3-D actuator system, the fundamental characteristics of the levitation for HTS bulks with individually controlled four and eight-polarities electromagnets were investigated experimentally. And two kinds of cap cores attached the top of the core to improve the control ability of proposed actuator were fabricated and tested.
Keywords :
actuators; high-temperature superconductors; magnetic levitation; superconducting magnets; transportation; 3D HTS actuator; electromagnets; high-temperature superconductor; levitation; silicon wafers; superconducting actuator; three-dimensional superconducting actuator; transportation device; trapped field patterns; trapped field strength; Actuators; Contamination; Control systems; Electromagnets; High temperature superconductors; Manufacturing; Protection; Silicon; Stators; Transportation; Actuator; HTS bulk; cap core; electromagnet;
Journal_Title :
Applied Superconductivity, IEEE Transactions on
DOI :
10.1109/TASC.2007.898974