DocumentCode
1067793
Title
Hot spot effects in hybrid circuits
Author
Rottiers, Luc ; De Mey, Gilbert
Author_Institution
Lab. of Electron., Ghent State Univ., Belgium
Volume
11
Issue
3
fYear
1988
Firstpage
274
Lastpage
278
Abstract
The temperature field due to a hot spot is investigated using a two-dimensional, an improved two-dimensional, and a three-dimensional analysis. It is shown that if the dimensions of the heat source are less than a critical distance, a two-dimensional approach fails even for substrates with a high-thermal conductivity. A combined model involving a local zooming is proposed.<>
Keywords
hybrid integrated circuits; thermal analysis; high-thermal conductivity; hot spot; hybrid circuits; local zooming; substrates; temperature field; three-dimensional analysis; two-dimensional approach; Ceramics; Circuit simulation; Eigenvalues and eigenfunctions; Equations; Power electronics; Printed circuits; Resistors; Temperature measurement; Thermal conductivity; Thermal resistance;
fLanguage
English
Journal_Title
Components, Hybrids, and Manufacturing Technology, IEEE Transactions on
Publisher
ieee
ISSN
0148-6411
Type
jour
DOI
10.1109/33.16653
Filename
16653
Link To Document