• DocumentCode
    1067845
  • Title

    Thermal, electrical and mechanical response in Nb3Sn superconducting coils

  • Author

    Ferracin, P. ; Caspi, S. ; Chiesa, L. ; Gourlay, S.A. ; Hafalia, R.R. ; Imbasciati, L. ; Lietzke, A.F. ; Sabbi, G. ; Scanlan, R.M.

  • Author_Institution
    Lawrence Berkeley Nat. Lab., CA, USA
  • Volume
    14
  • Issue
    2
  • fYear
    2004
  • fDate
    6/1/2004 12:00:00 AM
  • Firstpage
    361
  • Lastpage
    364
  • Abstract
    During a quench, significant temperatures can arise as a magnet´s stored energy is dissipated in the normal zone. Temperature gradients during this process give rise to localized strains within the coil. Reactive forces in the magnet structure balance the electromagnetic and thermal forces and maintain on equilibrium. In this paper we present a complete 3D finite element analysis of a racetrack coil. Specifically, the analysis focuses on thermal, electrical and mechanical conditions in a 10 T Nb3Sn coil built and tested as part of LBNL´s Subscale Magnet Program. The study attempts to simulate time history of the temperature and voltage rise during quench propagation. The transient thermal stress after the quench is then evaluated and discussed.
  • Keywords
    finite element analysis; niobium alloys; quenching (thermal); superconducting coils; superconducting magnets; thermal analysis; 10 tesla; 3D finite element analysis; LBNL; Nb3Sn; Subscale Magnet Program; electrical response; electromagnetic forces; magnet stored energy; magnet structure; mechanical response; normal zone; quench propagation; racetrack coil; reactive forces; superconducting coils; temperature gradients; thermal forces; thermal response; transient thermal stress; Coils; Electromagnetic forces; Finite element methods; Magnetic analysis; Magnetic field induced strain; Niobium; Temperature; Thermal force; Thermal stresses; Tin; Quench propagation; stress analysis; superconducting magnets; thermal analysis;
  • fLanguage
    English
  • Journal_Title
    Applied Superconductivity, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1051-8223
  • Type

    jour

  • DOI
    10.1109/TASC.2004.829130
  • Filename
    1324808