Title :
A creep-rupture model for two-phase eutectic solders
Author :
Wong, Boon ; Helling, Dondald E. ; Clark, Roy W.
Author_Institution :
Hughes Aircraft Co., El Segundo, CA, USA
Abstract :
An analytical framework to predict failure of solders under creep conditions is proposed. A creep-rupture model for two-phase eutectic solders, based on both micromechanics and fracture mechanics, has been developed. The general agreement between the model predictions and reported creep-rupture data in the literature for lead/tin eutectic solder indicates that the mode and mechanisms proposed in the model may control the solder creep-rupture process.<>
Keywords :
creep fracture; soldering; Pb-Sn; creep conditions; creep-rupture model; failure; fracture mechanics; micromechanics; two-phase eutectic solders; Creep; Failure analysis; Fatigue; Grain boundaries; Lead; Predictive models; Soldering; Temperature; Thermal stresses; Tin;
Journal_Title :
Components, Hybrids, and Manufacturing Technology, IEEE Transactions on
