DocumentCode
106827
Title
An External Circuit Model for 3-D Electromagnetic Particle-In-Cell Simulations
Author
Ming-Chieh Lin ; Chuandong Zhou ; Smithe, David N.
Author_Institution
Tech-X Corp., Boulder, CO, USA
Volume
61
Issue
6
fYear
2014
fDate
Jun-14
Firstpage
1742
Lastpage
1748
Abstract
In this paper, for the first time, second-order accurate algorithms for coupling external circuit elements to 3-D electromagnetic (EM) particle-in-cell (PIC) simulations are developed and introduced. The circuit equation including an external voltage or current source, resistance, inductance, capacitance, and a dynamic EM and/or plasma load is solved simultaneously and self-consistently with the EM PIC updaters through an instant measured voltage V across the system to obtain the supplied current I for feeding into the system. This external circuit model has been demonstrated and implemented in a 3-D conformal finite-difference time-domain PIC code, Vorpal. The integrated simulation model can be widely used in the vacuum electronics community as well as in the plasma processing community if one wants to consider the effects of a power supply on operation of microwave tubes or plasma reaction chambers.
Keywords
finite difference time-domain analysis; integrated circuit modelling; microwave tubes; power supply circuits; vacuum microelectronics; 3D conformal finite-difference time-domain PIC code; 3D electromagnetic particle-in-cell simulations; circuit equation; coupling external circuit elements; current source; external circuit model; external voltage; instant measured voltage; integrated simulation; microwave tubes; plasma load; plasma processing community; plasma reaction chambers; power supply; second-order accurate algorithms; supplied current; vacuum electronics; Electrodes; Equations; Integrated circuit modeling; Mathematical model; Plasmas; RLC circuits; Solid modeling; Conformal finite-difference time-domain (CFDTD); electromagnetic (EM); external circuit; particle-in-cell (PIC); particle-in-cell (PIC).;
fLanguage
English
Journal_Title
Electron Devices, IEEE Transactions on
Publisher
ieee
ISSN
0018-9383
Type
jour
DOI
10.1109/TED.2014.2304715
Filename
6744605
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