• DocumentCode
    1068723
  • Title

    A silicon-on-silicon field programmable multichip module (FPMCM) integrating FPGA and MCM technologies

  • Author

    Darnauer, Joel ; Isshiki, Tsuyoshi ; Garay, Porfirio ; Ramirez, John ; Maheshwari, Vijayshri ; Dai, Wayne Wei-Ming

  • Author_Institution
    Dept. of Comput. Eng., California Univ., Santa Cruz, CA, USA
  • Volume
    18
  • Issue
    4
  • fYear
    1995
  • fDate
    11/1/1995 12:00:00 AM
  • Firstpage
    601
  • Lastpage
    608
  • Abstract
    Multichip module technology can dramatically increase the capability of field programmable logic devices (FPLD´s) and field programmable systems (FPS). We present the special advantages that MCM´s offer FPLD´s and the design of our first-generation field programmable multichip module (FPMCM). Our prototype is the first silicon-on-silicon FPMCM and has a maximum capacity of 40 K gates and 256 user IO, achieving a factor of four increase in capacity over the FPLD family with which it was designed. Our FPMCM has bean demonstrated in a system that can deliver 200 MOP´s of computing power for image processing applications. FPMCM´s can cost-effectively deliver 4-8 times the capacity of the largest FPLD´s and provide even larger reductions in the area of PCB-based field programmable systems. The upper capacity limits for FPMCM are determined mainly by the cost and defect density of the substrate technology. As CMOS processes move into the deep-submicron range, FPMCM´s will even faster and denser substrates
  • Keywords
    field programmable gate arrays; multichip modules; FPGA; MCM; Si; area; capacity; computing power; field programmable logic device; field programmable multichip module; field programmable system; image processing; silicon-on-silicon FPMCM; Added delay; CMOS technology; Costs; Field programmable gate arrays; Logic circuits; Logic design; Manufacturing processes; Multichip modules; Packaging; Programmable logic arrays;
  • fLanguage
    English
  • Journal_Title
    Components, Packaging, and Manufacturing Technology, Part B: Advanced Packaging, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1070-9894
  • Type

    jour

  • DOI
    10.1109/96.475264
  • Filename
    475264