• DocumentCode
    1068951
  • Title

    Fault isolation and performance characterization of high speed digital multichip modules

  • Author

    Keezer, David C.

  • Author_Institution
    South Florida Univ., Tampa, FL, USA
  • Volume
    18
  • Issue
    4
  • fYear
    1995
  • fDate
    11/1/1995 12:00:00 AM
  • Firstpage
    614
  • Lastpage
    619
  • Abstract
    This paper describes two methods for testing high performance digital multichip modules (MCM´s). The first technique provides a method for multiplexing automatic test system channels so that clock and data rates can be extended beyond the normal frequency limits of the automatic test equipment (ATE). The multiplexing method has been successfully applied at rates up to 1.6 GHz using 200 MHz ATE. The second approach utilizes an electron beam probe system operating in the voltage contrast mode to measure electrical signals within the MCM. The e-beam probe can be used to supplement scan-based techniques for isolating faults. It can also be used for characterizing signal quality (risetime, overshoot, crosstalk, reflections) and measurement of relative delays in high performance MCM´s
  • Keywords
    automatic testing; electron beam applications; electron beam testing; fault diagnosis; fault location; integrated circuit testing; multichip modules; multiplexing; 1.6 GHz; 200 MHz; automatic testing; crosstalk; delays; electrical signals; electron beam probe; fault isolation; high speed digital multichip modules; multiplexing; overshoot; reflections; risetime; voltage contrast; Automatic test equipment; Automatic testing; Clocks; Electron beams; Frequency; Multichip modules; Multiplexing equipment; Probes; System testing; Voltage;
  • fLanguage
    English
  • Journal_Title
    Components, Packaging, and Manufacturing Technology, Part B: Advanced Packaging, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1070-9894
  • Type

    jour

  • DOI
    10.1109/96.475266
  • Filename
    475266