Title :
System design optimization for MCM-D/flip-chip
Author :
Franzon, Paul D. ; Stanaski, Andrew ; Tekmen, Yusuf ; Banerjia, Sanjeev
Author_Institution :
Dept. of Electr. & Comput. Eng., North Carolina State Univ., Raleigh, NC, USA
fDate :
11/1/1995 12:00:00 AM
Abstract :
Many performance/cost advantages can be gained if a chip-set is optimally redesigned to take advantage of the high wire density, fast interconnect delays, and high pin-counts available in MCM-D/flip-chip technology. Examples are given showing for what conditions the cost of the system can be reduced through chip partitioning and how the performance/cost of a computer core can be increased
Keywords :
circuit optimisation; delays; flip-chip devices; integrated circuit interconnections; multichip modules; MCM-D; chip partitioning; fast interconnect delays; flip-chip; high pin-counts; high wire density; system design optimization; Costs; Delay; Design automation; Design optimization; Integrated circuit interconnections; Packaging; Pins; Power system interconnection; Senior members; Timing;
Journal_Title :
Components, Packaging, and Manufacturing Technology, Part B: Advanced Packaging, IEEE Transactions on
