• DocumentCode
    1069481
  • Title

    OXIL, a versatile bipolar VLSI technology

  • Author

    Agraz-Güerena, Jorge ; Panousis, Peter T. ; Morris, B.L.

  • Author_Institution
    Bell Laboratories, Allentown, PA
  • Volume
    27
  • Issue
    8
  • fYear
    1980
  • fDate
    8/1/1980 12:00:00 AM
  • Firstpage
    1397
  • Lastpage
    1401
  • Abstract
    A bipolar VLSI technology, for Oxide Isolated Logic (OXIL) circuits has been developed which combines high-frequency conventional down-transistors with inverted up-transistors which are fabricated in a common process on the same chip site. The up-transistor is especially designed to optimize I2L circuits for high packing density, speed, and performance. High-pressure-steam oxide isolation and an up-diffused active base are combined to fabricate the up-transistor with f_{t} > 500 MHz and \\beta = 100 , which allows I2L delays down to 3 ns at FO = 1 and 7 ns at FO = 6 . The down-transistor is an oxide-isolated implanted-base transistor with an As emitter. It exhibits gains of 100-150 at f_{t} = 2 GHz and supports subnanosecond CML, high-current buffer circuitry, and linear interfacing.
  • Keywords
    Bipolar transistors; Delay; Design optimization; Helium; Integrated circuit technology; Isolation technology; Logic circuits; Pulse inverters; Silicon; Very large scale integration;
  • fLanguage
    English
  • Journal_Title
    Electron Devices, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9383
  • Type

    jour

  • DOI
    10.1109/T-ED.1980.20047
  • Filename
    1480840