DocumentCode
1069481
Title
OXIL, a versatile bipolar VLSI technology
Author
Agraz-Güerena, Jorge ; Panousis, Peter T. ; Morris, B.L.
Author_Institution
Bell Laboratories, Allentown, PA
Volume
27
Issue
8
fYear
1980
fDate
8/1/1980 12:00:00 AM
Firstpage
1397
Lastpage
1401
Abstract
A bipolar VLSI technology, for Oxide Isolated Logic (OXIL) circuits has been developed which combines high-frequency conventional down-transistors with inverted up-transistors which are fabricated in a common process on the same chip site. The up-transistor is especially designed to optimize I2L circuits for high packing density, speed, and performance. High-pressure-steam oxide isolation and an up-diffused active base are combined to fabricate the up-transistor with
MHz and
, which allows I2L delays down to 3 ns at
and 7 ns at
. The down-transistor is an oxide-isolated implanted-base transistor with an As emitter. It exhibits gains of 100-150 at
GHz and supports subnanosecond CML, high-current buffer circuitry, and linear interfacing.
MHz and
, which allows I2L delays down to 3 ns at
and 7 ns at
. The down-transistor is an oxide-isolated implanted-base transistor with an As emitter. It exhibits gains of 100-150 at
GHz and supports subnanosecond CML, high-current buffer circuitry, and linear interfacing.Keywords
Bipolar transistors; Delay; Design optimization; Helium; Integrated circuit technology; Isolation technology; Logic circuits; Pulse inverters; Silicon; Very large scale integration;
fLanguage
English
Journal_Title
Electron Devices, IEEE Transactions on
Publisher
ieee
ISSN
0018-9383
Type
jour
DOI
10.1109/T-ED.1980.20047
Filename
1480840
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