Title :
Foreword introduction to SEMI-THERM XVII special section
Author :
Manno, Vincent P. ; Simons, R.E. ; Wilson, James
Author_Institution :
Tufts University
Keywords :
Electronic equipment; Electronic packaging thermal management; Electronics cooling; Electronics packaging; History; Mechanical engineering; Power engineering and energy; Thermal management; Thermal management of electronics;
Journal_Title :
Components and Packaging Technologies, IEEE Transactions on
DOI :
10.1109/TCAPT.2002.800597
