Title : 
Development of Wireless MEMS Inclination Sensor System for Swing Monitoring of Large-Scale Hook Structures
         
        
            Author : 
Yu, Yan ; Ou, Jinping ; Zhang, Jun ; Zhang, Chunwei ; Li, Luyu
         
        
            Author_Institution : 
Inst. of Microelectron., Dalian Univ. of Technol., Dalian
         
        
        
        
        
            fDate : 
4/1/2009 12:00:00 AM
         
        
        
        
            Abstract : 
A modular wireless microelectromechanical system (MEMS) inclination sensor system (WMISS) is developed and tested for providing structural health monitoring of large-scale hook structures. The operating principle of a 3-D-MEMS-based dual-axis inclinometer is analyzed. A wireless MEMS sensor is integrated using sensing disposal, wireless communication, and power units. The WMISS is calibrated by using a laser displacement sensor in a pendular structure. The maximal error of the wireless MEMS inclination sensor is about 1%. The resolution is plusmn0.0025deg. With the new-type tuned mass damper control module, an experiment on a WMISS for the swing monitoring of a Lanjiang hook model is developed. Experimental results indicate that the developed WMISS is highly precise, convenient, stable, and low cost and has long range, and thus, a WMISS can accurately and conveniently monitor the swing of a Lanjiang hook model.
         
        
            Keywords : 
condition monitoring; microsensors; spatial variables measurement; structural engineering; 3D-MEMS-based dual-axis inclinometer; Lanjiang hook model; large-scale hook structures; laser displacement sensor; mass damper control module; modular wireless microelectromechanical system; structural health monitoring; swing monitoring; wireless MEMS inclination sensor system; 3-D MEMS; Hook structure; inclination; structural health monitoring (SHM); wireless microelectromechanical systems (MEMS) sensor;
         
        
        
            Journal_Title : 
Industrial Electronics, IEEE Transactions on
         
        
        
        
        
            DOI : 
10.1109/TIE.2009.2012469