• DocumentCode
    1070214
  • Title

    Development of Wireless MEMS Inclination Sensor System for Swing Monitoring of Large-Scale Hook Structures

  • Author

    Yu, Yan ; Ou, Jinping ; Zhang, Jun ; Zhang, Chunwei ; Li, Luyu

  • Author_Institution
    Inst. of Microelectron., Dalian Univ. of Technol., Dalian
  • Volume
    56
  • Issue
    4
  • fYear
    2009
  • fDate
    4/1/2009 12:00:00 AM
  • Firstpage
    1072
  • Lastpage
    1078
  • Abstract
    A modular wireless microelectromechanical system (MEMS) inclination sensor system (WMISS) is developed and tested for providing structural health monitoring of large-scale hook structures. The operating principle of a 3-D-MEMS-based dual-axis inclinometer is analyzed. A wireless MEMS sensor is integrated using sensing disposal, wireless communication, and power units. The WMISS is calibrated by using a laser displacement sensor in a pendular structure. The maximal error of the wireless MEMS inclination sensor is about 1%. The resolution is plusmn0.0025deg. With the new-type tuned mass damper control module, an experiment on a WMISS for the swing monitoring of a Lanjiang hook model is developed. Experimental results indicate that the developed WMISS is highly precise, convenient, stable, and low cost and has long range, and thus, a WMISS can accurately and conveniently monitor the swing of a Lanjiang hook model.
  • Keywords
    condition monitoring; microsensors; spatial variables measurement; structural engineering; 3D-MEMS-based dual-axis inclinometer; Lanjiang hook model; large-scale hook structures; laser displacement sensor; mass damper control module; modular wireless microelectromechanical system; structural health monitoring; swing monitoring; wireless MEMS inclination sensor system; 3-D MEMS; Hook structure; inclination; structural health monitoring (SHM); wireless microelectromechanical systems (MEMS) sensor;
  • fLanguage
    English
  • Journal_Title
    Industrial Electronics, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0278-0046
  • Type

    jour

  • DOI
    10.1109/TIE.2009.2012469
  • Filename
    4752773