Application of direct strain measurement to fatigue studies in surface solder joints

Author

Chan, Yan C. ; Xie, D.J. ; Lai, J.K.L. ; Hui, I.K.

Author_Institution

Dept. of Electron. Eng., City Polytech. of Hong Kong, Kowloon, Hong Kong

Volume

18

Issue

4

fYear

1995

fDate

11/1/1995 12:00:00 AM

Firstpage

715

Lastpage

719

Abstract

A direct method to measure the fatigue life of surface mount solder joints is proposed. This approach makes use of a quad flat pack (QFP) solder-printed circuit board (PCB) assembly as a shear specimen. After the assembly and thermal stress screening tests, the specimen is cut in half at the PCB. The displacement or strain variations between the split PCB´s during mechanical strain cycling reflect the fatigue properties of the solder joints. This approach is useful to predict the fatigue life of a practical surface solder joint in electronic products and applicable to any leaded and leadless surface joints. The measurement of joint strain and chip stiffness can reveal fatigue status in the solder joint system, which is important to the understanding of its fatigue mechanism

Keywords

deformation; elastic constants; fatigue; printed circuits; soldering; strain measurement; surface mount technology; QFP solder-PCB assembly; chip stiffness; direct strain measurement; displacement; fatigue life measurement; fatigue mechanism; joint strain; mechanical strain cycling; printed circuit board assembly; quad flat pack; strain variations; surface mount solder joints; Assembly; Capacitive sensors; Circuit testing; Electronics packaging; Fatigue; Lead; Printed circuits; Soldering; Strain measurement; Thermal stresses;

fLanguage

English

Journal_Title

Components, Packaging, and Manufacturing Technology, Part B: Advanced Packaging, IEEE Transactions on

Publisher

ieee

ISSN

1070-9894

Type

jour

DOI

10.1109/96.475280

Filename

475280