Title :
Parametric Testing of HYPRES Superconducting Integrated Circuit Fabrication Processes
Author :
Yohannes, Daniel ; Kirichenko, Alex ; Sarwana, Saad ; Tolpygo, Sergey K.
Author_Institution :
HYPRESS Inc., Elmsford
fDate :
6/1/2007 12:00:00 AM
Abstract :
A set of diagnostic chips for process control and design parameters evaluation has been developed for HYPRES´ 1.0 kA/cm2, 4.5 kA/cm2, and 20 kA/cm2 fabrication processes, consisting of four 5times5-mm chips. Testing was performed on automated test setup (OCTOPUX) that automatically logs results and maintains records of fabrication process and design parameters. The design of diagnostic structures and automated testing algorithms are discussed. Statistical data are presented on the uniformity and run-to-run variation of the critical currents, critical current density, junction size, inductances, and other fabrication and design parameters collected since September 2005. The influence of the fabrication parameters deviation on operational margins and yield of large superconducting digital integrated circuits is discussed, as well as requirements for the 20 kA/cm2 (80 GHz) process.
Keywords :
automatic testing; critical current density (superconductivity); digital integrated circuits; integrated circuit design; integrated circuit manufacture; integrated circuit testing; process control; process design; process monitoring; superconducting integrated circuits; HYPRES; OCTOPUX; automated test setup; critical current density; diagnostic chips; digital integrated circuits; junction size; parametric testing; process control; statistical data; superconducting integrated circuit fabrication processes; Algorithm design and analysis; Automatic testing; Circuit testing; Critical current; Fabrication; Integrated circuit testing; Performance evaluation; Process control; Process design; Superconducting integrated circuits; Critical current; Josephson device fabrication; Josephson junction; sheet inductance; sheet resistance; statistical process control; superconducting integrated circuits;
Journal_Title :
Applied Superconductivity, IEEE Transactions on
DOI :
10.1109/TASC.2007.897399