DocumentCode :
1071596
Title :
Modeling, Design, and Verification for the Analog Front-End of a MEMS-Based Parallel Scanning-Probe Storage Device
Author :
Hagleitner, Christoph ; Bonaccio, Tony ; Rothuizen, Hugo ; Lienemann, Jan ; Wiesmann, Dorothea ; Cherubini, Giovanni ; Korvink, Jan G. ; Eleftheriou, Evangelos
Author_Institution :
Zurich Res. Lab., Ruschlikon
Volume :
42
Issue :
8
fYear :
2007
Firstpage :
1779
Lastpage :
1789
Abstract :
We present an integrated analog front-end (AFE) for the read-channel of a parallel scanning-probe storage device. The read/write element is based on an array of microfabricated silicon cantilevers equipped with heating elements to form nanometer-sized indentations in a polymer surface using integral atomic-force microscope (AFM) tips. An accurate cantilever model based on the combination of a thermal/electrical lumped-element model and a behavioral model of the electrostatic/mechanical part are introduced. The behavioral model of the electrostatic/mechanical part is automatically generated from a full finite-element model (FEM). The model is completely implemented in Verilog-A and was used to co-develop the integrated analog front-end circuitry together with the read/write cantilever. The cantilever model and the analog front-end were simulated together and the results were experimentally verified. The approach chosen is well suited for system-level simulation and verification/extraction in a design environment based on standard EDA tools.
Keywords :
finite element analysis; integrated circuit modelling; integrated memory circuits; microactuators; micromachining; polymer films; reduced order systems; storage media; MEMS interface circuits; MEMS-based parallel scanning-probe storage device; analog front-end; analog integrated circuits; finite-element model; integral atomic-force microscope; integrated circuit modeling; microfabricated silicon cantilevers; model-order reduction; multidomain modeling; nanometer-sized indentations; nanotechnology; polymer surface; sensor interface circuits; Circuit simulation; Electrostatics; Hardware design languages; Heating; Integrated circuit modeling; Micromechanical devices; Polymer films; Probes; Silicon; Thermomechanical processes; Analog integrated circuits; MEMS interface circuits; integrated circuit modeling; model-order reduction; multi domain modeling; nanotechnology; sensor interface circuits;
fLanguage :
English
Journal_Title :
Solid-State Circuits, IEEE Journal of
Publisher :
ieee
ISSN :
0018-9200
Type :
jour
DOI :
10.1109/JSSC.2007.900287
Filename :
4277865
Link To Document :
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