Title :
SDA full-wave analysis of boxed multistrip superconducting lines of finite thickness embedded in a layered lossy medium
Author :
Deleniv, Anatoli N. ; Gashinova, Marina S. ; Vendik, Irina B.
Author_Institution :
Dept. of Microelectron., Chalmers Univ. of Technol., Goteborg, Sweden
fDate :
1/1/2003 12:00:00 AM
Abstract :
The spectral-domain approach is applied to modeling the propagation characteristics of a multiconductor structure of superconducting strip lines with signal strips and ground planes of finite thickness in lossy layered media. Two sets of basis functions (Chebyshev and Legendre polynomials) are compared by their ability for accurate modeling of microwave losses. Simple expressions within the immitance approach are presented for a power flux computation. As a result, complex propagation constants and related modal impedances of a multiconductor structure containing superconducting strips can be calculated with a high accuracy. The model applicability is illustrated by numerical results compared with available simulated data.
Keywords :
Chebyshev approximation; Galerkin method; Legendre polynomials; absorbing media; electromagnetic wave propagation; inhomogeneous media; losses; multiconductor transmission lines; spectral-domain analysis; strip lines; superconducting microwave devices; superconducting transmission lines; transmission line theory; Chebyshev functions; Legendre polynomials; boxed multistrip superconducting lines; complex propagation constants; embedded lines; finite thickness lines; ground planes; immitance approach; layered lossy medium; microwave losses modeling; modal impedances; multiconductor structure; power flux computation; propagation characteristics modeling; signal strips; spectral-domain analysis; superconducting strip lines; Chebyshev approximation; Impedance; Microwave propagation; Nonhomogeneous media; Polynomials; Propagation constant; Propagation losses; Strips; Superconducting epitaxial layers; Superconducting microwave devices;
Journal_Title :
Microwave Theory and Techniques, IEEE Transactions on
DOI :
10.1109/TMTT.2002.806907