A Ka-band power amplifier based on a low-profile slotted-waveguide power-combining/dividing circuit

Author

Jiang, Xin ; Liu, Li ; Ortiz, Sean C. ; Bashirullah, Rizwan ; Mortazawi, Amir

Author_Institution

Electr. Eng. & Comput. Sci. Dept., Univ. of Michigan, Ann Arbor, MI, USA

Volume

51

Issue

1

fYear

2003

fDate

1/1/2003 12:00:00 AM

Firstpage

144

Lastpage

147

Abstract

In this paper, a Ka-band power amplifier based on a resonant slotted-waveguide-to-microstrip power-dividing/combining circuit is presented. The advantages of this structure are its low profile, ease of fabrication, as well as its potential for high power-combining efficiency. In addition, efficient heat sinking of monolithic microwave integrated circuit (MMIC) devices is achieved. A slotted-waveguide power amplifier using eight MMIC amplifiers was designed and fabricated. The measured power-combining efficiency at 33 GHz is 72%. In addition, simulation results predicting the performance degradation of the slotted-waveguide power amplifier due to multiple device failure are presented.

Keywords

MMIC power amplifiers; failure analysis; heat sinks; integrated circuit reliability; microstrip couplers; microstrip lines; power combiners; power dividers; 33 GHz; 72 percent; Ka-band; MMIC amplifiers; heat sinking; low-profile slotted-waveguide power-combining/dividing circuit; multiple device failure; performance degradation; power amplifier; slotted-waveguide-to-microstrip power-dividing/combining circuit; Cogeneration; Electromagnetic heating; Fabrication; Heat sinks; MMICs; Microwave devices; Potential well; Power amplifiers; RLC circuits; Resonance;

fLanguage

English

Journal_Title

Microwave Theory and Techniques, IEEE Transactions on

Publisher

ieee

ISSN

0018-9480

Type

jour

DOI

10.1109/TMTT.2002.806927

Filename

1159677