DocumentCode
1073951
Title
Fabrication technology for an 80-ps normally-off GaAs MESFET logic
Author
Ida, Masao ; Mizutani, Takashi ; Asai, Kazwoshi ; Uchida, Masao ; Shimada, Keiho ; Ishida, Satoru
Author_Institution
Nippon Telegraph and Telephone Public Corporation, Tokyo, Japan
Volume
28
Issue
5
fYear
1981
fDate
5/1/1981 12:00:00 AM
Firstpage
489
Lastpage
493
Abstract
Fabrication technology of a high-speed normally-off GaAs MESFET logic has been described. Anodic Oxidation process is applied to control epitaxial layer thickness precisely. A SiO2 cap during alloying ohmic metal is used to prevent the ohmic layer surface from becoming uneven. A sloped mesa structure edge is used to avoid disconnection of metal interconnection. Electron-beam direct writing is employed to define a submicrometer gate. Applying these technologies, high-speed and small switching energy have been accomplished. The minimum delay timd and the associated switching energy were 77 ps and 75 fJ at room temperature and 51 ps and 97 fJ at 77 K.
Keywords
Alloying; Delay; Epitaxial layers; Fabrication; Gallium arsenide; Logic; MESFETs; Oxidation; Thickness control; Writing;
fLanguage
English
Journal_Title
Electron Devices, IEEE Transactions on
Publisher
ieee
ISSN
0018-9383
Type
jour
DOI
10.1109/T-ED.1981.20371
Filename
1481523
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