Title :
Small-Resistance and High-Quality-Factor Magnetic Integrated Inductors on PCB
Author :
Li, Liangliang ; Lee, Dok Won ; Hwang, Kyu-Pyung ; Min, Yongki ; Hizume, Toru ; Tanaka, Masato ; Mao, Ming ; Schneider, Thomas ; Bubber, Randhir ; Wang, Shan X.
Author_Institution :
Dept. of Mater. Sci. & Eng., Stanford Univ., Stanford, CA, USA
Abstract :
We have designed and fabricated both single-coil and parallel-coil magnetic integrated inductors with extremely small resistances and high quality factors on an 8-in-round printed circuit board (PCB) substrate for microprocessor power delivery applications. The dc resistances of these inductors are less than 12 mOmega. Soft magnetic material CoFeHfO was successfully integrated into the inductor fabrication to increase the inductance. The quality factors are more than 80 in a frequency range of 1.5-2 GHz for air-core inductors and more than 23 in a range of 200-300 MHz for magnetic inductors. The net inductance improvement of the magnetic inductor over air-core inductor is about 12%, which could be further enhanced with a thicker magnetic core, according to our theoretic calculation and HFSS simulation. We also characterized the permeability spectra of CoFeHfO material on the PCB substrate, simulated the high-frequency performance of the magnetic integrated inductor by HFSS, and, for the first time, reached a good agreement with the experimental data. The experimental and simulation results of the magnetic inductors as compared to those of the air-core inductors point out the future direction to further optimize magnetic integrated inductors.
Keywords :
cobalt compounds; electromagnetic induction; inductance measurement; inductors; iron compounds; printed circuits; soft magnetic materials; CoFeHfO; HFSS simulation; PCB; air-core inductors; dc resistances; frequency 1.5 GHz to 2 GHz; frequency 200 MHz to 300 MHz; microprocessor power delivery applications; parallel-coil magnetic integrated inductor; permeability spectra; printed circuit board; quality factors; single-coil magnetic integrated inductor; soft magnetic material; High-frequency simulation; magnetic integrated inductor; permeability; printed circuit board;
Journal_Title :
Advanced Packaging, IEEE Transactions on
DOI :
10.1109/TADVP.2009.2019845