Title :
A new analytical solution for the load-deflection of square membranes
Author :
Maier-Schneider, Dieter ; Maibach, J. ; Obermeier, Ernst
Author_Institution :
Dept. of Electr. Eng., Tech. Univ. Berlin, Germany
fDate :
12/1/1995 12:00:00 AM
Abstract :
Accurate models are essential for the determination of the elastic properties of thin films from load-deflection experiments. Although finite element method (FEM) models have the potential to be very accurate, analytical models are desirable because of their simplicity. In this paper we present a new analytical solution for the load-deflection of membranes. Our solution yields the same relationship between the load and the deflection as the known analytical solution. However, the values of two constants are up to 35% higher and correspond well with the results from FEM analysis. In addition, the new solution yields analytical forms of the bending lines, which agree well with experimental measurements carried out with silicon nitride membranes
Keywords :
bending; membranes; micromechanical devices; silicon compounds; Si3N4; bending lines; elastic properties; load deflection; square membranes; suspended thin films; Analytical models; Biomembranes; Capacitive sensors; Finite element methods; Potential energy; Pressure measurement; Residual stresses; Shape measurement; Tensile strain; Transistors;
Journal_Title :
Microelectromechanical Systems, Journal of
