DocumentCode :
1074767
Title :
Reliability of SiGe HBTs for Power Amplifiers—Part I: Large-Signal RF Performance and Operating Limits
Author :
Grens, Curtis M. ; Cheng, Peng ; Cressler, John D.
Author_Institution :
Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
Volume :
9
Issue :
3
fYear :
2009
Firstpage :
431
Lastpage :
439
Abstract :
This paper examines the performance and reliability implications associated with aggressively biased cascode SiGe HBT power-amplifier cores under large-signal RF operating conditions. The role of high-power RF stress on device degradation and failure is examined in detail. General expressions for a large-signal RF safe-operating area, which account for the effect of load impedance on the dynamic output current and voltage characteristics, are presented. These show excellent agreement with experimental results. Useful operating guidelines for reliable large-signal operation are provided.
Keywords :
BiCMOS analogue integrated circuits; Ge-Si alloys; MMIC power amplifiers; heterojunction bipolar transistors; integrated circuit reliability; semiconductor materials; HBT; SiGe; SiGe BiCMOS process; device degradation; dynamic output current; dynamic output voltage; high-power RF stress; large-signal RF performance; load impedance; power amplifier; reliability; Avalanche breakdown; SiGe HBTs; bipolar transistors; dynamic stress; mixed-mode stress; power amplifier (PA); reliability; safe-operating area (SOA);
fLanguage :
English
Journal_Title :
Device and Materials Reliability, IEEE Transactions on
Publisher :
ieee
ISSN :
1530-4388
Type :
jour
DOI :
10.1109/TDMR.2009.2025029
Filename :
5075546
Link To Document :
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