DocumentCode
1074778
Title
Reliability of SiGe HBTs for Power Amplifiers—Part II: Underlying Physics and Damage Modeling
Author
Cheng, Peng ; Grens, Curtis M. ; Cressler, John D.
Author_Institution
Georgia Inst. of Technol., Atlanta, GA, USA
Volume
9
Issue
3
fYear
2009
Firstpage
440
Lastpage
448
Abstract
This paper presents the underlying physics and modeling of aggressively biased cascode SiGe heterojunction bipolar transistor power amplifier (PA) cores under large-signal operating conditions. The damage characteristics observed during RF operation, particularly the base leakage and collector-base (CB) junction failure, are investigated in detail using dc stress methods. Base leakage was characterized across geometry, voltage, and current conditions, and a damage model is purposed based on Shockley-Read-Hall theory and the reaction-diffusion equation. This model is used to predict damage under aggressive RF operations, in order to extract the operational lifetime of SiGe PAs. The onset of CB junction failure was modeled using the current-gain collapse model, and it accurately captures the failure threshold current I Fail observed during RF stress.
Keywords
Ge-Si alloys; heterojunction bipolar transistors; power amplifiers; reaction-diffusion systems; semiconductor device models; semiconductor device reliability; Shockley-Read-Hall theory; SiGe; SiGe HBT; collector-base junction failure; current-gain collapse model; damage modeling; dc stress methods; heterojunction bipolar transistor; operational lifetime; power amplifiers; reaction-diffusion equation; reliability; Base leakage; RF stress; Shockley–Read–Hall (SRH); SiGe; heterojunction bipolar transistors (HBTs); lifetime; mixed-mode stress; pinch-in; power amplifier (PA); reaction–diffusion (R–D); reliability; stress damage;
fLanguage
English
Journal_Title
Device and Materials Reliability, IEEE Transactions on
Publisher
ieee
ISSN
1530-4388
Type
jour
DOI
10.1109/TDMR.2009.2025151
Filename
5075547
Link To Document