• DocumentCode
    1074778
  • Title

    Reliability of SiGe HBTs for Power Amplifiers—Part II: Underlying Physics and Damage Modeling

  • Author

    Cheng, Peng ; Grens, Curtis M. ; Cressler, John D.

  • Author_Institution
    Georgia Inst. of Technol., Atlanta, GA, USA
  • Volume
    9
  • Issue
    3
  • fYear
    2009
  • Firstpage
    440
  • Lastpage
    448
  • Abstract
    This paper presents the underlying physics and modeling of aggressively biased cascode SiGe heterojunction bipolar transistor power amplifier (PA) cores under large-signal operating conditions. The damage characteristics observed during RF operation, particularly the base leakage and collector-base (CB) junction failure, are investigated in detail using dc stress methods. Base leakage was characterized across geometry, voltage, and current conditions, and a damage model is purposed based on Shockley-Read-Hall theory and the reaction-diffusion equation. This model is used to predict damage under aggressive RF operations, in order to extract the operational lifetime of SiGe PAs. The onset of CB junction failure was modeled using the current-gain collapse model, and it accurately captures the failure threshold current I Fail observed during RF stress.
  • Keywords
    Ge-Si alloys; heterojunction bipolar transistors; power amplifiers; reaction-diffusion systems; semiconductor device models; semiconductor device reliability; Shockley-Read-Hall theory; SiGe; SiGe HBT; collector-base junction failure; current-gain collapse model; damage modeling; dc stress methods; heterojunction bipolar transistor; operational lifetime; power amplifiers; reaction-diffusion equation; reliability; Base leakage; RF stress; Shockley–Read–Hall (SRH); SiGe; heterojunction bipolar transistors (HBTs); lifetime; mixed-mode stress; pinch-in; power amplifier (PA); reaction–diffusion (R–D); reliability; stress damage;
  • fLanguage
    English
  • Journal_Title
    Device and Materials Reliability, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1530-4388
  • Type

    jour

  • DOI
    10.1109/TDMR.2009.2025151
  • Filename
    5075547