• DocumentCode
    1075031
  • Title

    Microstructure Observations of Ag and Ag-Alloy Sheathed Bi2223 Tapes

  • Author

    Liu, Hua Kun ; Zeng, Rong

  • Author_Institution
    Wollongong Univ., Wollongong
  • Volume
    17
  • Issue
    2
  • fYear
    2007
  • fDate
    6/1/2007 12:00:00 AM
  • Firstpage
    3095
  • Lastpage
    3098
  • Abstract
    37 filament Bi2223 tapes with different configurations of Ag, AgAu7wt% AgSb0.6wt% and AgMg0.2wt% as the precursor and restack sheaths were fabricated using commercial Bi2223 precursor material and powder-in-tube techniques. Short length samples were heat treated at a temperature in the range of 832degC to 846degC for the first stage (HT 1), followed by a second stage (HT 2) at 825degC for 40 h and slow cooled to 785degC. An intermediate roll pass was performed between the heat treatment stages. The critical current (Ic) of the tapes was measured at 77 K in self-field and in fields up to 1 T. The microstructure of the alloy sheaths was examined using optical microscopy, and the Bi2223 filaments after HT 1 and HT 2 were examined using scanning electron microscopy (SEM). It was observed that the sequence of hardness, tensile strength, and critical bend strains from higher to lower levels is very much related to the grain sizes in the restack sheath. Jc of the tapes in zero field and in applied field was influenced by the phase composition, core density, grain connectivity, grain alignment and the interface between the Bi2223 filament and sheath.
  • Keywords
    antimony alloys; bending; bismuth compounds; calcium compounds; critical currents; gold alloys; grain size; hardness; heat treatment; high-temperature superconductors; lead compounds; magnesium alloys; optical microscopy; scanning electron microscopy; silver; silver alloys; strontium compounds; superconducting tapes; tensile strength; Bi2PbSr2Ca2Cu3O10-Ag interface; Bi2PbSr2Ca2Cu3O10-AgAu interface; Bi2PbSr2Ca2Cu3O10-AgMg interface; Bi2PbSr2Ca2Cu3O10-AgSb interface; core density; critical bend strains; critical current; filament tapes; grain alignment; grain connectivity; grain sizes; hardness; heat treatment; magnetic flux density 1 T; microstructure; phase composition; restack sheaths; scanning electron microscopy; temperature 77 K; temperature 785 degC; temperature 825 degC; temperature 832 degC to 846 degC; tensile strength; time 40 h; Critical current; Current measurement; Electron optics; Grain size; Heat treatment; Microstructure; Optical microscopy; Scanning electron microscopy; Temperature distribution; Tensile strain; High temperature superconductors; silver; silver alloys; superconducting wires;
  • fLanguage
    English
  • Journal_Title
    Applied Superconductivity, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1051-8223
  • Type

    jour

  • DOI
    10.1109/TASC.2007.899494
  • Filename
    4278182