A novel power plane with integrated simultaneous switching noise mitigation capability using high impedance surface

Author

Kamgaing, Telesphor ; Ramahi, Omar M.

Author_Institution

Digital DNA Labs., Motorola Semicond. Products Sector Inc., Tempe, AZ, USA

Volume

13

Issue

1

fYear

2003

Firstpage

21

Lastpage

23

Abstract

A novel technique for suppressing power plane resonance at microwave and radio frequencies is presented. The new concept consists of replacing one of the plates of a parallel power plane pair with a high impedance surface or electromagnetic band gap structure. The combination of this technique with a wall of RC pairs extends the lower edge of the effective bandwidth to dc, and allows resonant mode suppression up to the upper edge of the band-gap. The frequency range for noise mitigation is controlled by the geometry of the HIGP structure.

Keywords

circuit noise; inductance; microwave circuits; power supply circuits; printed circuit design; PCB; RC pairs; effective bandwidth; electromagnetic band gap structure; high impedance surface; noise mitigation capability; power plane; power supply; reference plane; resonant mode suppression; simultaneous switching noise; Active noise reduction; Capacitors; Circuit noise; Joining processes; Photonic band gap; Radio frequency; Resonance; Semiconductor device noise; Surface impedance; Switches;

fLanguage

English

Journal_Title

Microwave and Wireless Components Letters, IEEE

Publisher

ieee

ISSN

1531-1309

Type

jour

DOI

10.1109/LMWC.2002.807713

Filename

1161574