Comparison between beryllium-copper and tungsten high frequency air coplanar probes

Author

Carbonero, J.-L. ; Morin, Gdrard ; Cabon, Bdatrice

Author_Institution

Central R&D, SGS-Thomson Microelectron., Crolles, France

Volume

43

Issue

12

fYear

1995

fDate

12/1/1995 12:00:00 AM

Firstpage

2786

Lastpage

2793

Abstract

High frequency air coplanar probes using tungsten tips are now available for silicon wafer probing with aluminum pads. A comparative study of the beryllium-copper and tungsten behavior is presented in terms of contact resistance values, stability and reproducibility. The contact theory is summarized for practical purposes and probe cleaning methods are exposed. Finally, tungsten is demonstrated to be the best material for breaking the aluminum oxide over the pad to enable accurate high frequency probing

Keywords

UHF measurement; beryllium alloys; contact resistance; copper alloys; integrated circuit testing; microwave measurement; probes; stability; surface cleaning; test equipment; tungsten; Al pads; Be-Cu; GaAs; HF air coplanar probes; Si; Si wafer probing; W; W tips; contact resistance; contact theory; high frequency probing; probe cleaning methods; reproducibility; stability; Aluminum oxide; Cleaning; Contact resistance; Electrical resistance measurement; Frequency measurement; Hafnium; Probes; Silicon; Transistors; Tungsten;

fLanguage

English

Journal_Title

Microwave Theory and Techniques, IEEE Transactions on

Publisher

ieee

ISSN

0018-9480

Type

jour

DOI

10.1109/22.475636

Filename

475636