Title :
Comparison between beryllium-copper and tungsten high frequency air coplanar probes
Author :
Carbonero, J.-L. ; Morin, Gdrard ; Cabon, Bdatrice
Author_Institution :
Central R&D, SGS-Thomson Microelectron., Crolles, France
fDate :
12/1/1995 12:00:00 AM
Abstract :
High frequency air coplanar probes using tungsten tips are now available for silicon wafer probing with aluminum pads. A comparative study of the beryllium-copper and tungsten behavior is presented in terms of contact resistance values, stability and reproducibility. The contact theory is summarized for practical purposes and probe cleaning methods are exposed. Finally, tungsten is demonstrated to be the best material for breaking the aluminum oxide over the pad to enable accurate high frequency probing
Keywords :
UHF measurement; beryllium alloys; contact resistance; copper alloys; integrated circuit testing; microwave measurement; probes; stability; surface cleaning; test equipment; tungsten; Al pads; Be-Cu; GaAs; HF air coplanar probes; Si; Si wafer probing; W; W tips; contact resistance; contact theory; high frequency probing; probe cleaning methods; reproducibility; stability; Aluminum oxide; Cleaning; Contact resistance; Electrical resistance measurement; Frequency measurement; Hafnium; Probes; Silicon; Transistors; Tungsten;
Journal_Title :
Microwave Theory and Techniques, IEEE Transactions on
