Title :
Novel Methods for Modeling of Multiple Vias in Multilayered Parallel-Plate Structures
Author :
Liu, En-Xiao ; Li, Er-Ping ; Oo, Zaw Zaw ; Wei, Xingchang ; Zhang, Yaojiang ; Vahldieck, Rüdiger
Author_Institution :
Adv. Electron. & Electromagn. Dept., A*STAR, Singapore, Singapore
fDate :
7/1/2009 12:00:00 AM
Abstract :
This paper presents novel modeling methods for accurate and efficient analysis of coupling of multiple vias in finite-sized multilayered parallel-plate structures. The new modeling methods address two open problems related to the modal expansion with the T-matrix method for the analysis of via coupling. First, a novel boundary modeling method, called the frequency-dependent cylinder layer (FDCL), is proposed to resolve the open problem of boundary modeling. In the FDCL, virtual cylinders with dynamic radii are postulated to approximate the original finite-sized boundary of parallel-plate structures. Second, a generalized T-matrix model, which is derived by the mode-matching technique, is created to characterize the coupling effect for vias penetrating more than one layer in a multilayered structure. With the two open problems successfully solved, the modal expansion with the T-matrix method incorporating the FDCL boundary modeling method and the generalized T-matrix model can now be fully utilized for efficient and accurate analysis of finite-sized multilayered parallel-plate structures with a large number of vias. Both numerical and experimental verifications are presented to validate the new modeling methods.
Keywords :
boundary-value problems; mode matching; multilayers; parallel plate waveguides; transfer function matrices; waveguide theory; FDCL; T-matrix method; boundary modeling method; frequency-dependent cylinder layer; mode-matching technique; multilayered parallel-plate structures; multiple vias; Boundary modeling; generalized T-matrix; high-speed electronic package modeling; modal expansion; signal and power integrity; via coupling;
Journal_Title :
Microwave Theory and Techniques, IEEE Transactions on
DOI :
10.1109/TMTT.2009.2022883