• DocumentCode
    1075541
  • Title

    Simulation of the Effect of Temperature on Flux-Flow Behavior in Stacked Intrinsic Josephson Junctions

  • Author

    Irie, Akinobu ; Oya, Gin-Ichiro

  • Author_Institution
    Dept. of Electr. & Electron. Syst. Eng., Utsunomiya Univ., Utsunomiya, Japan
  • Volume
    19
  • Issue
    3
  • fYear
    2009
  • fDate
    6/1/2009 12:00:00 AM
  • Firstpage
    730
  • Lastpage
    733
  • Abstract
    We have numerically studied the effect of temperature on the flux-flow behavior in a stack of intrinsic Josephson junctions by using the inductive coupling Josephson junctions model taking into account thermal fluctuations. In the absence of noise, the current-voltage characteristic shows a series of clear Fiske and flux-flow steps depending on an external magnetic field. With increasing temperature the Fiske steps corresponding to the out-of-phase mode remain on the current-voltage characteristic but other steps disappear. This suggests that the out-of-phase cavity mode becomes more stable than other modes due to the fluctuations. Furthermore, it is found that the in-phase flux flow mode is also strongly affected by the thermal noise in contrast to the out-of-phase one and fluctuations disturb the formation of the rectangular lattice of vortices even in the flux-flow mode driven by a strong Lorentz force Our results can qualitatively explain recent experimental observations in intrinsic Josephson junctions in the flux-flow state.
  • Keywords
    flux flow; magnetic fields; matrix algebra; superconducting junction devices; Lorentz force; current-voltage characteristic; external magnetic field; in-phase flux flow mode; inductive coupling junction model; out-of-phase cavity mode; stacked intrinsic Josephson junction; temperature effect; thermal fluctuation; ${rm Bi}_{2}{rm Sr}_{2}{rm CaCu}_{2}{rm O}_{y}$ ; flux flow; intrinsic Josephson junctions;
  • fLanguage
    English
  • Journal_Title
    Applied Superconductivity, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1051-8223
  • Type

    jour

  • DOI
    10.1109/TASC.2009.2019230
  • Filename
    5075611