• DocumentCode
    1075575
  • Title

    Impedance Matching of Microstrip Inductors in Digital Superconductive Electronics

  • Author

    Ortlepp, Thomas ; Uhlmann, F.Hermann

  • Author_Institution
    RSFQ Design Group, Ilmenau Univ. of Technol., Ilmenau, Germany
  • Volume
    19
  • Issue
    3
  • fYear
    2009
  • fDate
    6/1/2009 12:00:00 AM
  • Firstpage
    644
  • Lastpage
    648
  • Abstract
    State-of-the-art RSFQ circuits consist of Josephson junctions, inductances and bias current sources, where the inductances are practically used as functional elements. Even more, their value defines the functionality and therefore the conventional design process requires strict conditions for the wiring between Josephson junctions. The present design and optimization process does not take into account their parasitic capacitances to ground. This becomes an important issue for ultra fast applications above 100 GHz, but also for circuits dedicated to control quantum electronics. We report on a theoretical and experimental investigation of the influence of ground capacitances. The impedance matching between the connecting microstrip lines and the Josephson junction is a key issue for the correct operation of these circuits. We performed circuit simulations and collected experimental data of correct and incorrect operating circuits to derive design criteria. The critical reflection coefficient is found to be 0.35 and the particular design must use a smaller value for transfer and a larger value for storage of SFQ pulses, respectively.
  • Keywords
    impedance matching; inductors; microstrip lines; superconducting junction devices; superconducting microwave devices; Josephson junction; RSFQ circuits; digital superconductive electronics; impedance matching; microstrip inductor; microstrip lines; optimization process; quantum electronics; Bit-error rate; RSFQ; interconnects; superconducting devices; timing jitter;
  • fLanguage
    English
  • Journal_Title
    Applied Superconductivity, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1051-8223
  • Type

    jour

  • DOI
    10.1109/TASC.2009.2019284
  • Filename
    5075614