A new single-pole-type head trimmed by focused ion beam at wafer level

Author

Ikegawa, Y. ; Yamawaki, S. ; Ozaki, N. ; Hoshino, T. ; Kubomiya, T. ; Satoh, K. ; Koshikawa, T.

Author_Institution

Component Technol. Dept., Fujitsu Ltd., Nagano, Japan

Volume

40

Issue

4

fYear

2004

fDate

7/1/2004 12:00:00 AM

Firstpage

2338

Lastpage

2340

Abstract

We newly fabricated a trapezoidal main pole by focused ion beam (FIB) trimming method at wafer level. A layer of the main pole (MP) is FeCo/Ru multilayer made by sputtering. The thickness of the MP is 0.28 μm, and Ta protective layer is 0.17 μm thick. The taper angle of the MP is 10°. It is very easy to control of the angle and the width of the MP by using this method. In addition, the manufacturing methods of the MP film are not limited, and the multilayered film is enabled. Moreover, the processing precision of MP by the FIB method became a very practicable result. The head, which had been made by this method, has good characteristics.

Keywords

focused ion beam technology; magnetic heads; magnetic multilayers; perpendicular magnetic recording; 0.17 micron; 0.28 micron; FIB trimming method; FeCo-Ru; MP film; focused ion beam; manufacturing methods; multilayered film; perpendicular recording; processing precision; single-pole-type head; taper angle; trapezoidal main pole; wafer level; Disk recording; Ion beams; Magnetic films; Magnetic heads; Perpendicular magnetic recording; Protection; Remanence; Resists; Shape; Sputtering; FIB; Focused ion beam; perpendicular recording; single-pole-type-head; trimming;

fLanguage

English

Journal_Title

Magnetics, IEEE Transactions on

Publisher

ieee

ISSN

0018-9464

Type

jour

DOI

10.1109/TMAG.2004.832175

Filename

1325497