DocumentCode :
1076391
Title :
High Production Rate Process of YBCO Coated Conductors by TFA-MOD Process
Author :
Teranishi, Ryo ; Matsuda, Junko ; Nakaoka, Koichi ; Izumi, Teruo ; Shiohara, Yuh ; Mori, Nobuyuki ; Mukaida, Masashi
Author_Institution :
Kyushu Univ., Fukuoka
Volume :
17
Issue :
2
fYear :
2007
fDate :
6/1/2007 12:00:00 AM
Firstpage :
3317
Lastpage :
3320
Abstract :
Influence of process conditions including water vapor partial pressure, gas flow rate and total annealing pressure on YBa2Cu3O7-y (YBCO) film growth has been investigated in order to clarify the YBCO growth mechanism and to increase the growth rate. YBCO films have been fabricated on a LaAlO3 substrate by metalorganic deposition (MOD) process using tri- fluoroacetates (TFA) as a solute source. It was found that the processing parameters such as high water partial pressure, high diffusion constants due to low total pressure, and high gas flow rate affect the YBCO growth rate. Furthermore, it was empirically suggested that the growth rate of the YBCO film was in proportion to both the square root of water partial pressure and gas flow rate and was in inverse proportion to the one sixth power of the total pressure. The YBCO growth rate of about 2 times as fast as the previous condition was achieved with high performance by optimizing the process parameters.
Keywords :
MOCVD; annealing; barium compounds; high-temperature superconductors; superconducting thin films; vapour pressure; yttrium compounds; LaAlO3 surface; TFA-MOD method; YBCO coated conductors; YBCO films; YBa2Cu3O7; annealing pressure; diffusion constants; gas flow rate; growth mechanism; metalorganic deposition; spin coating; trifluoroacetates solute source; water vapor partial pressure; Annealing; Conductive films; Conductors; Costs; Crystallization; Fluid flow; Kinetic theory; Mass production; Superconductivity; Yttrium barium copper oxide; Coated conductors; TFA-MOD process; YBCO; growth rate;
fLanguage :
English
Journal_Title :
Applied Superconductivity, IEEE Transactions on
Publisher :
ieee
ISSN :
1051-8223
Type :
jour
DOI :
10.1109/TASC.2007.899412
Filename :
4278301
Link To Document :
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