DocumentCode
107650
Title
Cu Nanolines for RF Interconnects: Electrical Characterization
Author
Sarafis, Panagiotis ; Chuan-Lu Hsu ; Benech, Philippe ; Nassiopoulou, Androula G.
Author_Institution
Nat. Centre for Sci. Res. Demokritos, Inst. of Nanosci. & Nanotechnol., Athens, Greece
Volume
62
Issue
5
fYear
2015
fDate
May-15
Firstpage
1537
Lastpage
1543
Abstract
In this paper, we investigated the RF properties of Cu nanolines that are arranged in a coplanar waveguide (CPW) configuration. The signal tracks for the CPW transmission lines (CPW TLines) were either single Cu nanolines or multiple parallel Cu nanolines of equal total width and varying number. The total width was kept constant in order to study the validity of the litz-wire concept on the on-chip integrated CPW TLines. The metallization thickness was 100 nm and their width ranged from 50 nm to 1 μm. The RF characteristics of the nanolines were measured in the frequency range 40 MHz-40 GHz and the results were compared with those obtained from electromagnetic simulations. For these frequencies and nanolines dimensions, no improvement was observed when splitting the single line into multiple parallel lines. On the contrary, the resistance was increased according to the corresponding resistivity increase.
Keywords
coplanar waveguides; copper; integrated circuit interconnections; transmission lines; CPW transmission lines; Cu; RF interconnects; coplanar waveguide configuration; electrical characterization; electromagnetic simulations; frequency 40 MHz to 40 GHz; litz-wire concept; multiple parallel lines; multiple parallel nanolines; nanolines dimensions; on-chip integrated TLines; size 100 nm; size 50 nm to 1 mum; Conductivity; Coplanar waveguides; Impedance; Metals; Radio frequency; Resistance; Silicon; Coplanar waveguides (CPWs); Cu transmission lines; RF; RF.; nanolines;
fLanguage
English
Journal_Title
Electron Devices, IEEE Transactions on
Publisher
ieee
ISSN
0018-9383
Type
jour
DOI
10.1109/TED.2015.2409478
Filename
7063258
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