Title :
Characteristics Analysis of a High-Tc Persistent Current System With Double Pancake Magnet Using Coated Conductor
Author :
Yang, Seong Eun ; Park, Dong Keun ; Yoon, Yong Soo ; Kim, Yeong Sik ; Kim, Ho Min ; Ahn, Min Cheol ; Lee, Sang Jin ; Hong, Gye Won ; Ko, Tae Kuk
Author_Institution :
Yonsei Univ., Seoul
fDate :
6/1/2007 12:00:00 AM
Abstract :
Many superconductor applications such as magnetic levitation train (MAGLEV), magnetic resonance imaging (MRI) and superconducting magnetic energy storage (SMES) must be operated on persistent current mode to eliminate loss. Research on PCS using coated conductor (CC) tape has not been actively in progress, compare with that using BSCCO tape. In this paper, current charging rate was adjusted to 0.5 A/s to investigate operating characteristics of PCS. To analyse current decay during persistent current mode, new electrical equivalent model considering the n-value of CC was applied. Experimental results were compared with the theoretical results which were derived by applying finite deference method (FDM). We concluded that the characteristics of initial current decay were determined by the voltage generated in the load due to n-value, joint resistance and current charging.
Keywords :
barium compounds; finite difference methods; high-temperature superconductors; persistent currents; superconducting magnets; superconducting tapes; yttrium compounds; YBa2Cu3O7 - System; coated conductor tape; current charging rate; current decay; double pancake magnet; electrical equivalent model; finite deference method; high-Tc persistent current system; magnetic levitation train; magnetic resonance imaging; superconducting magnetic energy storage; superconductor; Conductors; Magnetic analysis; Magnetic levitation; Magnetic resonance imaging; Persistent currents; Personal communication networks; Samarium; Superconducting films; Superconducting magnetic energy storage; Superconducting magnets; Coated conductor; flux creep; joint resistance;
Journal_Title :
Applied Superconductivity, IEEE Transactions on
DOI :
10.1109/TASC.2007.897926