DocumentCode :
1076790
Title :
Key factors to enhance the switching characteristics in submicron MRAM cells
Author :
Kim, H.-J. ; Lee, J.E. ; Baek, I.G. ; Ha, Y.K. ; Bae, J.S. ; Oh, S.C. ; Park, S.O. ; Chung, U. In ; Lee, N.I. ; Kang, H.K. ; Moon, J.T.
Author_Institution :
Samsung Electron. Co. Ltd., Yongin-City, South Korea
Volume :
40
Issue :
4
fYear :
2004
fDate :
7/1/2004 12:00:00 AM
Firstpage :
2616
Lastpage :
2618
Abstract :
The dependence of the switching field distribution of magnetic random access memory cells on film roughness, saturation magnetization, film thickness, and cell aspect ratio is discussed. We found that a flat interface between the tunnel oxide and the magnetic film is very important in suppressing switching field variation. For free-layer materials, NiFe, CoNiFe, CoFeB, and lamellar structures are examined. By trying various compositions of these materials, we have improved switching characteristics with small saturation magnetization and small thickness. Good results with lamellar structures suggest that the suppression of the grain growth in the ferromagnetic layer is another effective way to get enhanced switching characteristics.
Keywords :
cobalt compounds; ferromagnetic materials; magnetic storage; magnetic switching; magnetic tunnelling; magnetisation; random-access storage; CoFeB; CoNiFe; cell aspect ratio; ferromagnetic layer; film roughness; film thickness; free-layer materials; grain growth suppression; lamellar structures; magnetic film; magnetic random access memory; magnetic tunnel junction; saturation magnetization; submicron MRAM cells; switching field distribution; switching field variation; tunnel oxide; CMOS process; Grain size; Magnetic fields; Magnetic films; Magnetic materials; Magnetic switching; Magnetic tunneling; Random access memory; Saturation magnetization; System-on-a-chip; MRAM; MTJ; Magnetic random access memory; SFD; magnetic tunnel junction; switching field distribution;
fLanguage :
English
Journal_Title :
Magnetics, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9464
Type :
jour
DOI :
10.1109/TMAG.2004.829813
Filename :
1325586
Link To Document :
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