Title :
High Transconductance MISFET With a Single InAs Nanowire Channel
Author :
Do, Q.-T. ; Blekker, K. ; Regolin, I. ; Prost, W. ; Tegude, F.J.
Author_Institution :
Univ. Duisburg-Essen, Duisburg
Abstract :
Metal-insulator field-effect transistors (FETs) are fabricated using a single n-InAs nanowire (NW) with a diameter of d = 50 nm as a channel and a silicon nitride gate dielectric. The gate length and dielectric scaling behavior is experimentally studied by means of dc output- and transfer-characteristics and is modeled using the long-channel MOSFET equations. The device properties are studied for an insulating layer thickness of 20-90 nm, while the gate length is varied from 1 to 5 mum. The InAs NW FETs exhibit an excellent saturation behavior and best breakdown voltage values of V BR > 3 V. The channel current divided by diameter d of an NW reaches 3 A/mm. A maximum normalized transconductance gm /d > 2 S/mm at room temperature is routinely measured for devices with a gate length of les 2 mum and a gate dielectric layer thickness of les 30 nm.
Keywords :
MISFET; dielectric materials; electric breakdown; indium compounds; nanowires; InAs - Binary; breakdown voltage; dielectric scaling; high transconductance MISFET; insulating layer thickness; metal-insulator field-effect transistors; silicon nitride gate dielectric; single nanowire channel; Dielectric measurements; Dielectrics and electrical insulation; Equations; FETs; MISFETs; MOSFET circuits; Metal-insulator structures; Silicon; Temperature measurement; Transconductance; InAs nanowire (NW) field-effect transistor (FET); omega-shaped gate; silicon nitride; vapor–liquid–solid (VLS) growth;
Journal_Title :
Electron Device Letters, IEEE
DOI :
10.1109/LED.2007.902082